Invention Grant
- Patent Title: Semiconductor device having super junction structure and method for manufacturing the same
- Patent Title (中): 具有超结结构的半导体器件及其制造方法
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Application No.: US13307878Application Date: 2011-11-30
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Publication No.: US08421154B2Publication Date: 2013-04-16
- Inventor: Takeshi Miyajima
- Applicant: Takeshi Miyajima
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2006-023145 20060131; JP2006-063833 20060309; JP2006-328397 20061205
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device having a super junction structure includes: multiple first columns extending in a current flowing direction; and multiple second columns extending in the current flowing direction. The first and second columns are alternately arranged in an alternating direction. Each first column provides a drift layer. The first and second columns have a boundary therebetween, from which a depletion layer expands in case of an off-state. At least one of the first columns and the second columns have an impurity dose, which is inhomogeneous by location with respect to the alternating direction.
Public/Granted literature
- US20120068298A1 SEMICONDUCTOR DEVICE HAVING SUPER JUNCTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-03-22
Information query
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