Invention Grant
US08421154B2 Semiconductor device having super junction structure and method for manufacturing the same 有权
具有超结结构的半导体器件及其制造方法

  • Patent Title: Semiconductor device having super junction structure and method for manufacturing the same
  • Patent Title (中): 具有超结结构的半导体器件及其制造方法
  • Application No.: US13307878
    Application Date: 2011-11-30
  • Publication No.: US08421154B2
    Publication Date: 2013-04-16
  • Inventor: Takeshi Miyajima
  • Applicant: Takeshi Miyajima
  • Applicant Address: JP Kariya
  • Assignee: DENSO CORPORATION
  • Current Assignee: DENSO CORPORATION
  • Current Assignee Address: JP Kariya
  • Agency: Posz Law Group, PLC
  • Priority: JP2006-023145 20060131; JP2006-063833 20060309; JP2006-328397 20061205
  • Main IPC: H01L29/66
  • IPC: H01L29/66
Semiconductor device having super junction structure and method for manufacturing the same
Abstract:
A semiconductor device having a super junction structure includes: multiple first columns extending in a current flowing direction; and multiple second columns extending in the current flowing direction. The first and second columns are alternately arranged in an alternating direction. Each first column provides a drift layer. The first and second columns have a boundary therebetween, from which a depletion layer expands in case of an off-state. At least one of the first columns and the second columns have an impurity dose, which is inhomogeneous by location with respect to the alternating direction.
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