Invention Grant
- Patent Title: Power module
- Patent Title (中): 电源模块
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Application No.: US13097389Application Date: 2011-04-29
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Publication No.: US08421163B2Publication Date: 2013-04-16
- Inventor: Kazuaki Hiyama
- Applicant: Kazuaki Hiyama
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-175372 20100804
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
A power module comprises: first and second terminals; first and second switching elements having a first electrode and a second electrode which is connected to the second terminal; first and second wirings respectively connecting the first electrodes of the first and second switching elements to the first terminal; and a third wiring directly connecting the first electrode of the first switching element to the first electrode of the second switching element, wherein parasitic inductances of the first and second wiring are different or switching characteristics of the first and second switching elements are different.
Public/Granted literature
- US20120032725A1 POWER MODULE Public/Granted day:2012-02-09
Information query
IPC分类: