Invention Grant
- Patent Title: Solid-state imaging device, electronic module and electronic apparatus
- Patent Title (中): 固态成像装置，电子模块和电子装置
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Application No.: US13036559Application Date: 2011-02-28
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Publication No.: US08421178B2Publication Date: 2013-04-16
- Inventor: Yasushi Maruyama
- Applicant: Yasushi Maruyama
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2007-003552 20070111
- Main IPC: H01L31/10
- IPC: H01L31/10
Abstract:
A solid-state imaging device including an imaging area formed of a plurality of pixels arrayed in a two-dimensional matrix is provided. The solid-state imaging device includes: a photoelectric conversion portion including a charge accumulation region provided on a semiconductor substrate; a read transistor for reading electric charges from the photoelectric conversion portion; and a gettering site for separating metal impurities within the semiconductor substrate from at least the photoelectric conversion portion. The photoelectric conversion portion is provided on the surface side of the semiconductor substrate, and the gettering site is provided on the rear side away from the semiconductor substrate.
Public/Granted literature
- US20110147876A1 SOLID-STATE IMAGING DEVICE, ELECTRONIC MODULE AND ELECTRONIC APPARATUS Public/Granted day:2011-06-23
Information query
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