Invention Grant
- Patent Title: Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same
- Patent Title (中): 具有粘合挤出防止结构的半导体部件及其制造方法
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Application No.: US13171382Application Date: 2011-06-28
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Publication No.: US08421219B2Publication Date: 2013-04-16
- Inventor: Tsuyoshi So , Hideo Kubo , Seiji Ueno , Osamu Igawa
- Applicant: Tsuyoshi So , Hideo Kubo , Seiji Ueno , Osamu Igawa
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/60 ; H01L23/02
Abstract:
A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member.
Public/Granted literature
- US20110254149A1 SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT Public/Granted day:2011-10-20
Information query
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