Invention Grant
- Patent Title: Microelectronic device provided with an array of elements made from a conductive polymer with a positive temperature coefficient
- Patent Title (中): 具有由具有正温度系数的导电聚合物制成的元件阵列的微电子器件
-
Application No.: US13377274Application Date: 2010-06-11
-
Publication No.: US08421230B2Publication Date: 2013-04-16
- Inventor: Didier Louis , Jean Du Port De Poncharra
- Applicant: Didier Louis , Jean Du Port De Poncharra
- Applicant Address: FR Paris
- Assignee: Commissariat à l'énergie atomique et aux énergies alternatives
- Current Assignee: Commissariat à l'énergie atomique et aux énergies alternatives
- Current Assignee Address: FR Paris
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR0953908 20090611
- International Application: PCT/EP2010/058252 WO 20100611
- International Announcement: WO2010/142793 WO 20101216
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
Production of a device including: a substrate; multiple components forming an electronic circuit on the substrate; multiple superimposed metal levels of interconnections of the components, wherein the metal levels are located in at least one insulating layer resting on the substrate; and multiple elements made from a positive temperature coefficient conductive polymer material, wherein the elements traverse the insulating layer to a given depth, and are connected to at least one conductive line of a given interconnection level.
Public/Granted literature
Information query
IPC分类:
