Invention Grant
- Patent Title: Electrically conductive composite
- Patent Title (中): 导电复合材料
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Application No.: US11988183Application Date: 2006-07-03
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Publication No.: US08421231B2Publication Date: 2013-04-16
- Inventor: Kian-Hoon Peter Ho , Lay-Lay Chua , Sankaran Sivaramakrishnan , Perq Jon Chia
- Applicant: Kian-Hoon Peter Ho , Lay-Lay Chua , Sankaran Sivaramakrishnan , Perq Jon Chia
- Applicant Address: SG Singapore
- Assignee: National University of Singapore
- Current Assignee: National University of Singapore
- Current Assignee Address: SG Singapore
- Agency: Venable LLP
- Agent Michael A. Sartori
- International Application: PCT/IB2006/001829 WO 20060703
- International Announcement: WO2007/004033 WO 20070111
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
The present invention provides a conductive composite comprising: suspension matrix, metal nanoparticles suspended within the suspension matrix, wherein the conductive composite has a conductivity greater than 104 S cm−1.
Public/Granted literature
- US20080265414A1 Electrically Conductive Composite Public/Granted day:2008-10-30
Information query
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