Invention Grant
- Patent Title: Semiconductor device and automotive ac generator
- Patent Title (中): 半导体装置和汽车交流发电机
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Application No.: US13117544Application Date: 2011-05-27
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Publication No.: US08421232B2Publication Date: 2013-04-16
- Inventor: Osamu Ikeda , Masato Nakamura , Satoshi Matsuyoshi , Koji Sasaki , Shinji Hiramitsu
- Applicant: Osamu Ikeda , Masato Nakamura , Satoshi Matsuyoshi , Koji Sasaki , Shinji Hiramitsu
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2005-251090 20050831
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52
Abstract:
A semiconductor device includes a semiconductor element, a support member bonded to a first surface of the semiconductor element with a first bonding material and a lead electrode bonded to a second surface of the semiconductor element supported on the support member with a second bonding material, and further including a method of producing the semiconductor device. Respective connecting parts of the support member and the lead electrode are Ni-plated and each of the first and the second bonding material is a Sn solder having a Cu6Sn5 content greater than a eutectic content.
Public/Granted literature
- US20110223718A1 SEMICONDUCTOR DEVICE AND AUTOMOTIVE AC GENERATOR Public/Granted day:2011-09-15
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