Invention Grant
- Patent Title: Light-mixing multichip package structure
- Patent Title (中): 混合多芯片封装结构
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Application No.: US13069276Application Date: 2011-03-22
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Publication No.: US08421373B2Publication Date: 2013-04-16
- Inventor: Chia-Tin Chung , Shih-Neng Dai , Chao-Chin Wu
- Applicant: Chia-Tin Chung , Shih-Neng Dai , Chao-Chin Wu
- Applicant Address: TW Taoyuan County
- Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.
- Current Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.
- Current Assignee Address: TW Taoyuan County
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: TW100102836A 20110126
- Main IPC: H05B37/02
- IPC: H05B37/02

Abstract:
A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a frame unit, and a package unit. The light-emitting unit includes at least one first light-emitting module with red light-emitting chips and at least one second light-emitting module with blue light-emitting chips. The frame unit includes at least one first continuous colloid frame and at least one second continuous colloid frame respectively surrounding the first light-emitting module and the second light-emitting module. The package unit includes a transparent colloid body and a phosphor colloid body respectively covering the first light-emitting module and the second light-emitting module. Hence, when the red light source generated by matching the red light-emitting chips and the transparent colloid body and the white light source generated by matching the blue light-emitting chips and the phosphor colloid body are mixed with each other, the CRI of the light-mixing multichip package structure can be increased.
Public/Granted literature
- US20120187865A1 LIGHT-MIXING MULTICHIP PACKAGE STRUCTURE Public/Granted day:2012-07-26
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