Invention Grant
US08421498B2 Semiconductor device with bus connection circuit and method of making bus connection
有权
具有总线连接电路的半导体器件和总线连接方法
- Patent Title: Semiconductor device with bus connection circuit and method of making bus connection
- Patent Title (中): 具有总线连接电路的半导体器件和总线连接方法
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Application No.: US13157852Application Date: 2011-06-10
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Publication No.: US08421498B2Publication Date: 2013-04-16
- Inventor: Takeshi Ichikawa
- Applicant: Takeshi Ichikawa
- Applicant Address: JP
- Assignee: Lapis Semiconductor Co., Ltd.
- Current Assignee: Lapis Semiconductor Co., Ltd.
- Current Assignee Address: JP
- Agency: Rabin & Berdo, P.C.
- Priority: JP2010-143864 20100624
- Main IPC: H03K19/003
- IPC: H03K19/003 ; H03K17/16

Abstract:
A semiconductor device capable of achieving desirable communication behavior through a bus regardless of whether or not a pull-up resistor is connected on a bus line. The semiconductor device includes external pull-up determination unit and internal pull-up setting unit. The external pull-up determination unit applies a pull-down voltage through an internal pull-down resistor to the bus line, and determines whether an external pull-up resistor external to the semiconductor device is connected on the bus line on the basis of the voltage level of the bus line when the pull-down voltage is applied to the bus line. The internal pull-up setting unit stops application of the pull-down voltage, and applies a pull-up voltage through an internal pull-up resistor to the bus line if it is determined that no external pull-up resistor is connected on the bus line. The internal pull-up setting unit stops application of the pull-down voltage if it is determined that the external pull-up resistor is connected on the bus line.
Public/Granted literature
- US20110316581A1 SEMICONDUCTOR DEVICE WITH BUS CONNECTION CIRCUIT AND METHOD OF MAKING BUS CONNECTION Public/Granted day:2011-12-29
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