Invention Grant
- Patent Title: Multilayer microstripline transmission line transition
- Patent Title (中): 多层微带线传输线转换
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Application No.: US12913741Application Date: 2010-10-27
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Publication No.: US08421551B2Publication Date: 2013-04-16
- Inventor: Lance Dion Lascari
- Applicant: Lance Dion Lascari
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Taft Stettinius & Hollister LLP
- Agent Keith Swedo
- Main IPC: H03H7/38
- IPC: H03H7/38

Abstract:
A microstripline transmission line arrangement carries a signal having a fundamental frequency. The arrangement includes a first microstripline transmission line, a second microstripline transmission line, and a coaxial electrically conductive conduit interconnecting the first transmission line and the second transmission line. The conduit includes a signal conductor and an electrically grounded shield substantially surrounding the signal conductor. The conductor and the shield are positioned relative to each other to thereby comprise a means for lowpass filtering the signal. A cutoff frequency of the lowpass filtering is less than a third harmonic of the fundamental frequency.
Public/Granted literature
- US20110037532A1 MULTILAYER MICROSTRIPLINE TRANSMISSION LINE TRANSITION Public/Granted day:2011-02-17
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