An electronic component and manufacturing method are provided that allow an increase in a size of a circuit element included therein and suppression of a short-circuit-preventing insulator film from easily peeling off from a laminated body. The laminated body includes a plurality of insulator layers laminated on one another. The laminated body has an upper face and a lower face opposing each other in a z-axis direction and lateral faces connecting the upper face to the lower face. The insulator film is provided on the lateral faces. A circuit element such as a coil is included in the laminated body and has a part protruding from the lateral faces of the laminated body toward the insulator film.