Invention Grant
- Patent Title: Radio-frequency system in package including antenna
- Patent Title (中): 包括天线在内的射频系统
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Application No.: US12845230Application Date: 2010-07-28
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Publication No.: US08421686B2Publication Date: 2013-04-16
- Inventor: Jordi Soler Castany , Jaume Anguera Pros , Carles Puente Baliarda , Carmen Borja Borau , José Mumbru Forn
- Applicant: Jordi Soler Castany , Jaume Anguera Pros , Carles Puente Baliarda , Carmen Borja Borau , José Mumbru Forn
- Applicant Address: ES Barcelona
- Assignee: Fractus, S.A.
- Current Assignee: Fractus, S.A.
- Current Assignee Address: ES Barcelona
- Agency: Kenyon & Kenyon LLP
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/38

Abstract:
A system comprising at least one antenna and a circuit, wherein the circuit is at least in part not a semiconductor chip or a die. The at least one antenna and the circuit are arranged on a package. Alternatively described is a system comprising at least one antenna and at least one circuit, wherein the at least one antenna and the at least one circuit are arranged on a package, wherein the at least one circuit performs a radio-frequency and optionally a base-band and/or a digital functionality.
Public/Granted literature
- US20100328185A1 RADIO-FREQUENCY SYSTEM IN PACKAGE INCLUDING ANTENNA Public/Granted day:2010-12-30
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