- Patent Title: Electronic element wafer module; electronic element module; sensor wafer module; sensor module; lens array plate; manufacturing method for the sensor module; and electronic information device
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Application No.: US12316057Application Date: 2008-12-09
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Publication No.: US08422136B2Publication Date: 2013-04-16
- Inventor: Masahiro Hasegawa
- Applicant: Masahiro Hasegawa
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Edwards Wildman Palmer LLP
- Agent George W. Neuner
- Priority: JP2007-322626 20071213; JP2007-322627 20071213
- Main IPC: G02B27/10
- IPC: G02B27/10
Abstract:
An electronic element wafer module is provided, comprising: an electronic element wafer arranged with a plurality of electronic elements having a through hole electrode; a resin adhesion layer formed in a predetermined area on the electronic element wafer; a transparent cover member covering the electronic element wafer and fixed on the resin adhesion layer; and a plurality of resin optical elements adhered and fixed on the transparent cover member to be integrated in such a manner to correspond to the respective plurality of electronic elements.
Public/Granted literature
Information query
