Invention Grant
- Patent Title: ESD protection device
- Patent Title (中): ESD保护装置
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Application No.: US12458765Application Date: 2009-07-22
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Publication No.: US08422188B2Publication Date: 2013-04-16
- Inventor: Yasuhiro Hirobe , Kensaku Asakura , Atsushi Hitomi , Takeshi Urano
- Applicant: Yasuhiro Hirobe , Kensaku Asakura , Atsushi Hitomi , Takeshi Urano
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2008-190781 20080724; JP2008-320098 20081216; JP2009-143018 20090616
- Main IPC: H02H1/04
- IPC: H02H1/04 ; H02H3/22

Abstract:
An ESD protection device that has low capacitance, excellent discharge characteristics, and improved heat resistance and weather resistance is provided. A functional layer 31, which is a composite having a conductive inorganic material 33 discretely dispersed in a matrix of an insulating inorganic material 32, is disposed between electrodes 21 and 22 disposed on an insulating substrate 11 and facing but spaced apart from each other.
Public/Granted literature
- US20100020454A1 ESD protection device Public/Granted day:2010-01-28
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