Invention Grant
- Patent Title: Electric double layer capacitor package and method of manufacturing the same
- Patent Title (中): 双电层电容器封装及其制造方法
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Application No.: US12926107Application Date: 2010-10-26
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Publication No.: US08422198B2Publication Date: 2013-04-16
- Inventor: Sang Kyun Lee , Jung Eun Noh , Bae Kyun Kim
- Applicant: Sang Kyun Lee , Jung Eun Noh , Bae Kyun Kim
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2010-0047519 20100520
- Main IPC: H01G9/00
- IPC: H01G9/00

Abstract:
There is provided an electric double layer capacitor package and a method of manufacturing the same. The electric double layer capacitor package includes an exterior case formed of insulating resin and having therein one or more partitions providing a plurality of housing spaces; a plurality of capacitor cells disposed in the plurality of housing spaces, respectively, each capacitor cell including first and second electrodes and a separator interposed between the first and second electrodes; and an internal series-connection terminal buried in each of the partitions and connecting the plurality of capacitor cells in series.
Public/Granted literature
- US20110286149A1 Electric double layer capacitor package and method of manufacturing the same Public/Granted day:2011-11-24
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