Invention Grant
- Patent Title: Conductive structure having an embedded electrode, and solid capacitor having an embedded electrode and method of making the same
- Patent Title (中): 具有嵌入电极的导电结构和具有嵌入电极的固体电容器及其制造方法
-
Application No.: US13115964Application Date: 2011-05-25
-
Publication No.: US08422200B2Publication Date: 2013-04-16
- Inventor: Wei-Chih Lee , Ming-Tsung Chen
- Applicant: Wei-Chih Lee , Ming-Tsung Chen
- Applicant Address: TW Miaoli County TW Miaoli County
- Assignee: Inpaq Technology Co., Ltd.,Apaq Technology Co., Ltd.
- Current Assignee: Inpaq Technology Co., Ltd.,Apaq Technology Co., Ltd.
- Current Assignee Address: TW Miaoli County TW Miaoli County
- Agency: Li&Cai Intellectual Property (USA) Office
- Main IPC: H01G9/00
- IPC: H01G9/00

Abstract:
A solid capacitor having an embedded electrode includes a substrate unit, a first conductive unit, a second conductive unit, a first insulative unit, a third conductive unit, a second insulative unit, and an end electrode unit. The substrate unit includes a substrate body and a conductive body embedded into the substrate body. The substrate body has a lateral opening and a plurality of top openings, and the conductive body has a lateral conductive area exposed from the lateral opening and a plurality of top conductive areas respectively exposed from the top openings. The first conductive unit includes a plurality of first conductive layers respectively covering the top conductive areas. The second conductive unit includes a second conductive layer covering the first conductive layers. The porosity rate of the second conductive layer is larger than that of each first conductive layer.
Public/Granted literature
Information query