A cooling device includes an enclosure, an external heat rejection device, a primary cooling system including a loop heat pipe like device. The LHPL device includes, an evaporator module, a condenser module, a vapor line, a liquid return line, and a working fluid having a liquid phase and a vapor phase. The evaporator module includes a component-evaporator heat spreader, an evaporator body, and an evaporator-component clamping mean. The evaporator body includes an evaporator outer shell, a working fluid inlet port, a compensation chamber, a working fluid exit port, and an evaporator wick having vapor escape channels. The condenser module includes a condenser coolant inlet, a condenser coolant exit, a condenser condensation channel, a condensation channel working fluid inlet, a condensation channel working fluid exit, and a condensation channel-coolant thermal interface further comprises a coolant passageway. The secondary cooling system including a secondary coolant, the secondary cooling system cooling a secondary heat rejecting component, wherein the secondary heat rejecting component is one of the plurality of other components.