Invention Grant
- Patent Title: Multi-modular data center
- Patent Title (中): 多模块数据中心
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Application No.: US12859288Application Date: 2010-08-19
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Publication No.: US08422223B2Publication Date: 2013-04-16
- Inventor: Tsung-Han Su , Chung-I Lee , Chun-Ming Chen
- Applicant: Tsung-Han Su , Chung-I Lee , Chun-Ming Chen
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99122651A 20100709
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A multi-modular data center includes at least one modular computing module and at least one modular power supply module. The modular computing module includes a transportable container, a plurality of computing systems, a cooling system, a surveillance system, and a network interface. The modular power supply module includes a transportable container and a plurality of power supply systems. The transportable containers are configured for transport via a transport infrastructure. The plurality of computing systems is mounted within the transportable container. The cooling system is disposed in the transportable container. The surveillance system is configured to monitor the transportable container. The network interface is configured to interface between an Internet access connection and the computing systems. The plurality of power supply systems is mounted within the transportable container.
Public/Granted literature
- US20120006507A1 MULTI-MODULAR DATA CENTER Public/Granted day:2012-01-12
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