Invention Grant
- Patent Title: Structure for fixing circuit board
- Patent Title (中): 电路板固定结构
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Application No.: US13009142Application Date: 2011-01-19
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Publication No.: US08422242B2Publication Date: 2013-04-16
- Inventor: Linger Lin
- Applicant: Linger Lin
- Applicant Address: TW Taipei
- Assignee: Inventec Corporation
- Current Assignee: Inventec Corporation
- Current Assignee Address: TW Taipei
- Agency: WPAT PC
- Agent Justin King
- Priority: TW99133788A 20101005
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K1/00 ; H05K1/18 ; H05K7/00 ; H01R13/62

Abstract:
A structure for fixing circuit board, adapted for fixing a circuitboard at the rear of a cage, is disclosed, which comprises: a circuitboard; and a clamp, configured with a clipping part, a fixing part and an elastic part; wherein, the clipping part is coupled to the fixing part while the fixing part is coupled to the elastic part; the clipping part has a first hook formed at a surface facing toward the fixing part; the elastic part has a second hook formed extruding out form a surface facing away from the fixing part; the clipping part and the fixing part are arranged straddling across the top edge of the circuitboard while enabling the first hook to couple to a fastener of the circuitboard; and the elastic part is arranged facing toward the cage while enabling the second hook to secure to the bottom of the cage.
Public/Granted literature
- US20120081862A1 STRUCTURE FOR FIXING CIRCUIT BOARD Public/Granted day:2012-04-05
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