Invention Grant
- Patent Title: Electric apparatus module
- Patent Title (中): 电器模块
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Application No.: US12993963Application Date: 2009-05-21
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Publication No.: US08422247B2Publication Date: 2013-04-16
- Inventor: Isao Kameyama
- Applicant: Isao Kameyama
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-133976 20080522
- International Application: PCT/JP2009/059381 WO 20090521
- International Announcement: WO2009/142276 WO 20091126
- Main IPC: H05K7/18
- IPC: H05K7/18

Abstract:
An electric apparatus module 1 includes an upper casing 6, a lower casing 7 to which the upper casing 6 is attached and which is attached to a rear panel 2, an electronic device unit 8 accommodated in the upper casing 6 and the lower casing 7, a conductive shield shell 9 covering the electronic device unit 8, and a conductive ground shell 10 which is attached to the lower casing 7 at a side of the rear panel 2. The ground shell 10 includes a flat plate portion 83 piled on the rear panel 2, a contact piece 84 erected from an outer edge 83c of the flat plate portion 83 toward the lower case 7, and a contact member 85 protruded from a rear surface 83b of the flat plate portion 83 at the side of the rear panel 2. The contact piece 84 is inserted through a through hole 56 formed on the lower casing 7 to contact with the shield shell 9. The contact member 85 is inserted through a through hole 11 formed on the rear panel 2 to contact a cylindrical shield member 22 of an external device.
Public/Granted literature
- US20110096524A1 ELECTRIC APPARATUS MODULE Public/Granted day:2011-04-28
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