Invention Grant
- Patent Title: Load reduced memory module and memory system including the same
- Patent Title (中): 负载减少的内存模块和包含相同的内存系统
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Application No.: US12801326Application Date: 2010-06-03
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Publication No.: US08422263B2Publication Date: 2013-04-16
- Inventor: Shunichi Saito , Toshio Sugano , Atsushi Hiraishi , Fumiyuki Osanai , Masayuki Nakamura , Hiroki Fujisawa
- Applicant: Shunichi Saito , Toshio Sugano , Atsushi Hiraishi , Fumiyuki Osanai , Masayuki Nakamura , Hiroki Fujisawa
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2009-136649 20090605
- Main IPC: G11C5/06
- IPC: G11C5/06

Abstract:
A memory module includes a plurality of memory chips, a plurality of data register buffers, and a command/address/control register buffer mounted on a module PCB. The data register buffers perform data transfers with the memory chips. The command/address/control register buffer performs buffering of a command/address/control signal and generates a control signal. The buffered command/address/control signal is supplied to the memory chips, and the control signal is supplied to the data register buffers. According to the present invention, because line lengths between the data register buffers and the memory chips are shortened, it is possible to realize a considerably high data transfer rate.
Public/Granted literature
- US20100309706A1 Load reduced memory module and memory system including the same Public/Granted day:2010-12-09
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