Invention Grant
- Patent Title: Memory chips and memory devices using the same
- Patent Title (中): 内存芯片和使用相同的内存设备
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Application No.: US12830967Application Date: 2010-07-06
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Publication No.: US08422315B2Publication Date: 2013-04-16
- Inventor: Chi Hsiang Sun
- Applicant: Chi Hsiang Sun
- Applicant Address: TW Taichung County
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung County
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Main IPC: G11C7/06
- IPC: G11C7/06

Abstract:
A memory chip is provided and includes a control unit, a wait controller, and a wait receiver. When the memory chip operates in an active mode and the control unit determines that the memory chip will be changed to operate in an inactive mode according to an input address signal, the wait controller changes a state of a wait signal at a wait pad from a de-asserted state to an asserted state. When the memory chip operates in an inactive mode and the wait receiver detects that the state of the wait signal has been changed from the de-asserted state to the asserted state, the control unit determines whether the memory chip will be changed to operate in the active mode or a word-line boundary crossing operation will be performed to another memory chip.
Public/Granted literature
- US20120011327A1 MEMORY CHIPS AND MEMORY DEVICES USING THE SAME Public/Granted day:2012-01-12
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