Invention Grant
- Patent Title: Nitride based semiconductor device and fabrication method for the same
- Patent Title (中): 氮化物基半导体器件及其制造方法
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Application No.: US13371490Application Date: 2012-02-13
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Publication No.: US08422527B2Publication Date: 2013-04-16
- Inventor: Daisuke Nakagawa , Yoshinori Tanaka , Masahiro Murayama , Takao Fujimori , Shinichi Kohda
- Applicant: Daisuke Nakagawa , Yoshinori Tanaka , Masahiro Murayama , Takao Fujimori , Shinichi Kohda
- Applicant Address: JP Kyoto-fu
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Rabin & Berdo, P.C.
- Priority: JPP2008-054830 20080305; JPP2008-099150 20080407; JPP2008-117178 20080428; JPP2008-117182 20080428; JPP2008-126955 20080514; JPP2008-132396 20080520; JPP2008-226007 20080903
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
A nitride based semiconductor device includes: an n-type cladding layer; an n-type GaN based guide layer placed on the n-type cladding layer; an active layer placed on the n-type GaN based guide layer; a p-type GaN based guide layer placed on the active layer; an electron block layer placed on the p-type GaN based guide layer; a stress relaxation layer placed on the electron block layer; and a p-type cladding layer placed on the stress relaxation layer, and the nitride based semiconductor device alleviates the stress occurred under the influence of the electron block layer, does not affect light distribution by the electron block layer, reduces threshold current, can suppress the degradation of reliability, can suppress degradation of the emitting end surface of the laser beam, can improve the far field pattern, and is long lasting, and fabrication method of the device is also provided.
Public/Granted literature
- US20120140785A1 NITRIDE BASED SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SAME Public/Granted day:2012-06-07
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