Invention Grant
US08423153B2 Method for producing implant structures for contacting or electrostimulation of living tissue cells or nerves 有权
用于生产用于接触或电刺激活组织细胞或神经的植入物结构的方法

  • Patent Title: Method for producing implant structures for contacting or electrostimulation of living tissue cells or nerves
  • Patent Title (中): 用于生产用于接触或电刺激活组织细胞或神经的植入物结构的方法
  • Application No.: US12296519
    Application Date: 2007-01-26
  • Publication No.: US08423153B2
    Publication Date: 2013-04-16
  • Inventor: Hans-Jurgen Tiedtke
  • Applicant: Hans-Jurgen Tiedtke
  • Applicant Address: CH Zug
  • Assignee: IMI Intelligent Medical Implants, AG
  • Current Assignee: IMI Intelligent Medical Implants, AG
  • Current Assignee Address: CH Zug
  • Agency: Workman Nydegger
  • Priority: DE102006017549 20060413
  • International Application: PCT/EP2007/000686 WO 20070126
  • International Announcement: WO2007/118527 WO 20071025
  • Main IPC: A61N1/04
  • IPC: A61N1/04
Method for producing implant structures for contacting or electrostimulation of living tissue cells or nerves
Abstract:
The object, to create a method for producing multilayers or multilayer systems wherein the structures generated on a substrate can easily be jointly detached from the substrate and are preserved in a composite, is achieved by the present invention by means of a method for producing implant structures comprising generating a first metal layer on a substrate, generating a second metal layer above the first metal layer, producing a number of multilayered implant structures above the second metal layer, removing the first metal layer between the substrate and the second metal layer, and releasing the implant structures from the substrate in a coherent composite. With the method according to the invention, between the implant structures and the substrate a release layer is generated consisting of two or three metal layers which serve as sacrificial layer in the course of releasing the fully processed multilayers by means of an under-etching process. As a result, a uniform and reliable separation of the finished multilayers from the substrate in a composite is achieved, facilitating the subsequent technology for assembly and interconnection of the implant structures.
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