Invention Grant
- Patent Title: Lead assemblies with one or more switching networks
- Patent Title (中): 具有一个或多个交换网络的引线组件
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Application No.: US13494878Application Date: 2012-06-12
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Publication No.: US08423154B2Publication Date: 2013-04-16
- Inventor: Zdzislaw B. Malinowski , Salomo S. Murtonen
- Applicant: Zdzislaw B. Malinowski , Salomo S. Murtonen
- Applicant Address: US CA Valencia
- Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee Address: US CA Valencia
- Agency: Frommer Lawrence & Haug LLP
- Agent Bruce E. Black
- Main IPC: A61N1/05
- IPC: A61N1/05
Abstract:
Exemplary lead assemblies include a lead body having a plurality of conductor wires embedded therein, a plurality of electrode contacts at least partially disposed on an outer surface of the lead body, and a plurality of switching networks each configured to control an operation of one or more of the plurality of electrode contacts.
Public/Granted literature
- US20120259387A1 LEAD ASSEMBLIES WITH ONE OR MORE SWITCHING NETWORKS Public/Granted day:2012-10-11
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