Invention Grant
- Patent Title: Dual PCI-X/PCI-E card
- Patent Title (中): 双PCI-X / PCI-E卡
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Application No.: US11037177Application Date: 2005-01-19
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Publication No.: US08423695B2Publication Date: 2013-04-16
- Inventor: Charles J. Purwin
- Applicant: Charles J. Purwin
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H05K7/10
- IPC: H05K7/10

Abstract:
A dual bus interface PCB includes a main chipset component, a first type bus interface connector, and a second type bus interface connector. The PCB can be configured at fabrication time to enable a variety of configurations for operation. Optionally, the PCB can also be provided at least one memory chip and a NIC (Network Interface Card) chip. By virtue of having a dual interface, the PCB can be used with either the first type or the second type bus. Furthermore, the dual interface PCB eliminates the need by chipset manufacturers to carry multiple PCB variations of the same product in order to support various bus interfaces. In one embodiment, the PCB is a dual PCI-X/PCI-E interface PCB.
Public/Granted literature
- US20060161717A1 Dual PCI-X/PCI-E card Public/Granted day:2006-07-20
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