Invention Grant
- Patent Title: Structural migration of integrated circuit layout
- Patent Title (中): 集成电路布局的结构迁移
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Application No.: US13205186Application Date: 2011-08-08
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Publication No.: US08423941B2Publication Date: 2013-04-16
- Inventor: Fook-Luen Heng , Rajiv V. Joshi , Alexey Y. Lvov , Xiaoping Tang
- Applicant: Fook-Luen Heng , Rajiv V. Joshi , Alexey Y. Lvov , Xiaoping Tang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Preston Young
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Methods and systems for migrating circuit layouts. A floorplan layout is built for a target circuit using a subset of constraints that characterize a layout structure of an original circuit. Shape-constraint-based scaling is used on the floorplan layout by scaling parts of the floorplan layout in accordance with a plurality of different scaling ratios such that portions of the floorplan layout are concurrently scaled with the plurality of different scaling ratios. Cells are placed at locations defined by the floorplan layout. The floorplan layout is checked with shape-constraint-based legalization using all of the constraints to produce a migrated layout.
Public/Granted literature
- US20130042217A1 STRUCTURAL MIGRATION OF INTEGRATED CIRCUIT LAYOUT Public/Granted day:2013-02-14
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