Invention Grant
US08424175B2 Process for fabricating piezoelectrically actuated ultrananocrystalline diamond tip array integrated with ferroelectric or phase change media for high-density memory 有权
用于制造与铁电或相变介质集成的压电致动超晶体金刚石尖端阵列用于高密度存储器的工艺

  • Patent Title: Process for fabricating piezoelectrically actuated ultrananocrystalline diamond tip array integrated with ferroelectric or phase change media for high-density memory
  • Patent Title (中): 用于制造与铁电或相变介质集成的压电致动超晶体金刚石尖端阵列用于高密度存储器的工艺
  • Application No.: US12556771
    Application Date: 2009-09-10
  • Publication No.: US08424175B2
    Publication Date: 2013-04-23
  • Inventor: Orlando H. Auciello
  • Applicant: Orlando H. Auciello
  • Applicant Address: US IL Argonne
  • Assignee: UChicago Argonne, LLC
  • Current Assignee: UChicago Argonne, LLC
  • Current Assignee Address: US IL Argonne
  • Agency: Tolpin & Partners, PC
  • Agent Thomas W. Tolpin
  • Main IPC: H04R17/10
  • IPC: H04R17/10 H04R31/00
Process for fabricating piezoelectrically actuated ultrananocrystalline diamond tip array integrated with ferroelectric or phase change media for high-density memory
Abstract:
A process for fabricating a piezoactuated storage device having a tip array and a memory media, which includes but is not limited to: etching the regions on the surface of the silicon wafer to produce substantially pyramidal etch pits by anisotropic etching or chemical etching with potassium hydroxide (KOH); growing an oxide layer on a top surface of the silicon wafer and in the substantially pyramidal etch pits to produce oxidation sharpening of the substantially pyramidal etch pits; forming an array of conductive tips of a nanocarbon film of nanostructured carbon material by deposition, wherein the nanostructured carbon material is ultrananocrystalline diamond (UNCD), ta-C, or diamond-like carbon films; and forming an oxygen diffusion barrier layer by deposition of a TiAl, TaAl, or any other oxygen diffusion barrier layer material on the nanocarbon film.
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