Invention Grant
- Patent Title: Fluid-filled type vibration damping device
- Patent Title (中): 流体填充式减震装置
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Application No.: US12865970Application Date: 2009-11-04
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Publication No.: US08424854B2Publication Date: 2013-04-23
- Inventor: Hiroyuki Ichikawa , Yuichi Ogawa , Naoki Furumachi
- Applicant: Hiroyuki Ichikawa , Yuichi Ogawa , Naoki Furumachi
- Applicant Address: JP Komaki-Shi
- Assignee: Tokai Rubber Industries, Ltd.
- Current Assignee: Tokai Rubber Industries, Ltd.
- Current Assignee Address: JP Komaki-Shi
- Agency: Oliff & Berridge, PLC
- Priority: JP2008-331150 20081225
- International Application: PCT/JP2009/005860 WO 20091104
- International Announcement: WO2010/073462 WO 20100701
- Main IPC: F16F5/00
- IPC: F16F5/00

Abstract:
A fluid-filled type vibration damping device wherein a low-frequency orifice passage and at least one high-frequency orifice passage are formed in a partition member, which is supported by a second mounting member; a valve body is disposed at least at one opening of the high-frequency orifice passage and is provided with a spring member that in a nonloaded state positions the valve body away from the opening of the high-frequency orifice passage to hold the high-frequency orifice passage in an open state; and, at times of vibration input, the valve body is adapted to block the high-frequency orifice passage in opposition to a holding force of the spring member.
Public/Granted literature
- US20110006466A1 FLUID-FILLED TYPE VIBRATION DAMPING DEVICE Public/Granted day:2011-01-13
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