Invention Grant
- Patent Title: Powder compression molding machine
- Patent Title (中): 粉末压塑机
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Application No.: US13137968Application Date: 2011-09-22
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Publication No.: US08425215B2Publication Date: 2013-04-23
- Inventor: Yoshitsugu Oneda , Kunihiky Tsutsui
- Applicant: Yoshitsugu Oneda , Kunihiky Tsutsui
- Applicant Address: JP Kyoto
- Assignee: Kikusui Seisakusho Ltd.
- Current Assignee: Kikusui Seisakusho Ltd.
- Current Assignee Address: JP Kyoto
- Agency: McGinn IP Law Group, PLLC
- Priority: JPP2010-225697 20101005
- Main IPC: B29C43/56
- IPC: B29C43/56

Abstract:
A powder compression molding machine includes a downward spray portion that sprays a lubricant toward an inner circumferential surface of a die bore and a tip face of a tip of a lower punch, an upward spray portion that sprays the lubricant toward a tip face of the tip of the upper punch, a first lubricant flow passage through which the lubricant supplied from a lubricant supply device externally provided is fed to the downward spray portion, and a second lubricant flow passage through which the lubricant supplied from the lubricant supply device externally provided is fed to the upward spray portion. A small-diameter region of which an inner diameter is made smaller than that of the first lubricant flow passage is provided at a part of the second lubricant flow passage.
Public/Granted literature
- US20120082743A1 Powder compression molding machine Public/Granted day:2012-04-05
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