Invention Grant
US08425217B2 Method for installing indirect and direct mold pressure, temperature and flow front detection sensors without machining the mold
有权
在不加工模具的情况下安装间接和直接模具压力，温度和流量前端检测传感器的方法
- Patent Title: Method for installing indirect and direct mold pressure, temperature and flow front detection sensors without machining the mold
- Patent Title (中): 在不加工模具的情况下安装间接和直接模具压力，温度和流量前端检测传感器的方法
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Application No.: US12655165Application Date: 2009-12-23
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Publication No.: US08425217B2Publication Date: 2013-04-23
- Inventor: Rodney J. Groleau
- Applicant: Rodney J. Groleau
- Agency: McKellar IP Law, PLLC
- Agent Robert L. McKellar
- Main IPC: B29C45/40
- IPC: B29C45/40 ; B29C45/76
Abstract:
A molding apparatus includes a mold cavity (26), an ejector pin (30), and a sensor (42). The ejector pin has a first surface (48) exposed to the cavity and a second surface (40) not exposed to the cavity. The sensor (42) is in communicative contact with the ejector pin second surface (40). The sensor (42) is capable of sensing pressure in a mold cavity (26) through the ejector pin (30). The molding apparatus may include a hollow ejector pin (108) with a first end (120) facing the mold cavity (26). A sensor (104) embedded in the hollow ejector pin first end (120) senses a mold cavity parameter. A signal line (112) from the sensor (104) is routed through the hollow ejector pin (108).
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