Invention Grant
- Patent Title: Die assembly for injection molding
- Patent Title (中): 模具组装注塑成型
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Application No.: US13202764Application Date: 2010-02-04
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Publication No.: US08425222B2Publication Date: 2013-04-23
- Inventor: Masayoshi Uehira , Akihiro Iwane , Akihiko Matsumoto , Takahito Muroi
- Applicant: Masayoshi Uehira , Akihiro Iwane , Akihiko Matsumoto , Takahito Muroi
- Applicant Address: JP Tokyo
- Assignee: Konica Minolta Opto, Inc.
- Current Assignee: Konica Minolta Opto, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Cozen O'Connor
- Priority: JP2009-041873 20090225
- International Application: PCT/JP2010/051604 WO 20100204
- International Announcement: WO2010/098188 WO 20100902
- Main IPC: B29C45/33
- IPC: B29C45/33
Abstract:
Taper portions 151 and 161 are provided in the cavity of a stationary side die 110 and the cavity of a movable side die 120 in an injection molding apparatus, respectively, and a floating mechanism 170 is provided so that one taper portions are able to freely follows the other taper portions while die clamping. This configuration makes it possible to correct axial misalignment in each of the cavities.
Public/Granted literature
- US20120040044A1 Die Assembly for Injection Molding Public/Granted day:2012-02-16
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