A socket receptive to insertion of an integrated circuit (IC) printed circuit board (PCB) includes a housing, conductors, and vents. The housing has first and second sides corresponding to a length of the IC PCB. The conductors are mounted within the housing to mate with corresponding conductors of the IC PCB upon insertion of the IC PCB into the housing, and have leads adapted to being soldered to corresponding conductors of a host PCB. The vents are within the housing and are adapted to dissipate heat resulting from soldering the leads to the host PCB to minimize warping of the housing during soldering. The vents are further adapted to compensate for a mismatch between a coefficient of thermal expansion (CTE) of the housing and a CTE of the host PCB during soldering, regardless of the CTE of the host PCB.