Invention Grant
- Patent Title: Modular percutaneous spinal fusion
- Patent Title (中): 模块化经皮脊髓融合
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Application No.: US12818827Application Date: 2010-06-18
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Publication No.: US08425565B2Publication Date: 2013-04-23
- Inventor: T. Wade Fallin , Daniel F. Justin
- Applicant: T. Wade Fallin , Daniel F. Justin
- Applicant Address: US UT Logan
- Assignee: IMDS Corporation
- Current Assignee: IMDS Corporation
- Current Assignee Address: US UT Logan
- Agent Peter K. Johnson; James Carson; James M. Pinkston
- Main IPC: A61B17/70
- IPC: A61B17/70

Abstract:
A posterior spinal fusion system may include pedicle screws and one or more segments designed to be attached to the implanted pedicle screws via nuts to fuse spinal motion segments in a modular fashion. The pedicle screws may have semispherical receiving surfaces, and each segment may have mounting portions at both ends, with corresponding semispherical engagement surfaces. The nuts may also have semispherical surfaces. The semispherical surfaces permit polyaxial adjustment of the relative orientations of the segments and pedicle screws. Each mounting portion may have a passageway therethrough to receive the proximal end of the corresponding pedicle screw; each passageway may intersect the edge of the corresponding engagement surface to facilitate percutaneous placement. Such placement may be carried out through cannulae to provide a minimally invasive (MIS) implantation procedure.
Public/Granted literature
- US20100256682A1 MODULAR PERCUTANEOUS SPINAL FUSION Public/Granted day:2010-10-07
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