A method of providing chiplets over a substrate including providing in sequence a substrate; coating an adhesive in a layer over the substrate; placing a plurality of first chiplets onto the adhesive layer in separated chiplet location(s) to adhere the first chiplets to the adhesive layer, wherein one or more of the first chiplets do not adhere to the adhesive layer, so that first chiplet(s) are adhered to the adhesive layer in adhered chiplet location(s) and first chiplet(s) are not adhered in non-adhered chiplet location(s); locally processing the adhesive layer in the non-adhered chiplet location(s) to condition the adhesive layer in the non-adhered locations to receive second chiplets; placing second chiplet(s) onto the adhesive layer in the conditioned non-adhered chiplet location(s) to adhere the second chiplets in the adhesive layer in the non-adhered locations; and curing the adhesive.