Invention Grant
- Patent Title: Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films
- Patent Title (中): 用于沉积含铜铟镓薄膜的电镀方法和化学品
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Application No.: US12642702Application Date: 2009-12-18
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Publication No.: US08425753B2Publication Date: 2013-04-23
- Inventor: Serdar Aksu , Mustafa Pinarbasi
- Applicant: Serdar Aksu , Mustafa Pinarbasi
- Applicant Address: US CA San Jose
- Assignee: SoloPower, Inc.
- Current Assignee: SoloPower, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Main IPC: C25D5/10
- IPC: C25D5/10 ; C25D5/50 ; C25D7/12 ; C25D3/56

Abstract:
The present invention provides a method and precursor structure to form a solar cell absorber layer. The method includes electrodepositing a first layer including a film stack including at least a first film comprising copper, a second film comprising indium and a third film comprising gallium, wherein the first layer includes a first amount of copper, electrodepositing a second layer onto the first layer, the second layer including at least one of a second copper-indium-gallium-ternary alloy film, a copper-indium binary alloy film, a copper-gallium binary alloy film and a copper-selenium binary alloy film, wherein the second layer includes a second amount of copper, which is higher than the first amount of copper, and electrodepositing a third layer onto the second layer, the third layer including selenium; and reacting the precursor stack to form an absorber layer on the base.
Public/Granted literature
- US20100140101A1 ELECTROPLATING METHODS AND CHEMISTRIES FOR DEPOSITION OF COPPER-INDIUM-GALLIUM CONTAINING THIN FILMS Public/Granted day:2010-06-10
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