The present invention provides a semiconductive polymer composition having (a) from 30 to 90 wt % of a polymer component, (b) from 10 to 60 wt % of carbon black and (c) from 0 to 8 wt % additives, based on the total semiconductive polymer composition, and wherein the composition comprises less than 23 particles per m2 having a width of larger than 150 μm at the half height of a particle protruding from the surface of the tape sample, less than 10 particles per m2 having a width of larger than 200 μm at the half height of a particle protruding from the surface of the tape sample, and preferably, about 0 particles per m2 having a width of larger than 500 μm at the half height of a particle protruding from the surface of the tape sample.