Invention Grant
- Patent Title: Photosensitive composition, pattern-forming method using the photosensitve composition and compound in the photosensitive composition
- Patent Title (中): 感光组合物，使用光敏组合物中的光敏组合物和化合物的图案形成方法
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Application No.: US11642540Application Date: 2006-12-21
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Publication No.: US08426101B2Publication Date: 2013-04-23
- Inventor: Kenji Wada , Hiromi Kanda
- Applicant: Kenji Wada , Hiromi Kanda
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-368351 20051221; JP2005-379030 20051228
- Main IPC: G03C1/00
- IPC: G03C1/00 ; G03F7/00 ; C07C315/00 ; C07C309/00
Abstract:
A photosensitive composition containing a compound having a specific structure as described in the specification, a pattern-forming method using the photosensitive composition and the compound having a specific structure used in the photosensitive composition.
Public/Granted literature
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