Invention Grant
- Patent Title: Patterning process and resist composition
- Patent Title (中): 图案化过程和抗蚀剂组成
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Application No.: US12849344Application Date: 2010-08-03
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Publication No.: US08426115B2Publication Date: 2013-04-23
- Inventor: Jun Hatakeyama , Kazuhiro Katayama , Youichi Ohsawa , Masaki Ohashi
- Applicant: Jun Hatakeyama , Kazuhiro Katayama , Youichi Ohsawa , Masaki Ohashi
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2009-181504 20090804
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/039 ; G03F7/20 ; G03F7/26 ; G03F7/40

Abstract:
A pattern is formed by coating a first positive resist composition comprising a copolymer comprising lactone-containing recurring units, acid labile group-containing recurring units and carbamate-containing recurring units, and a photoacid generator onto a substrate to form a first resist film, patternwise exposure, PEB, and development to form a first resist pattern, heating the first resist pattern for inactivation to acid, coating a second positive resist composition comprising a C3-C8 alcohol and an optional C6-C12 ether onto the first resist pattern-bearing substrate to form a second resist film, patternwise exposure, PEB, and development to form a second resist pattern.
Public/Granted literature
- US20110033803A1 PATTERNING PROCESS AND RESIST COMPOSITION Public/Granted day:2011-02-10
Information query
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