A method of manufacturing a semiconductor device is provided. The method includes providing a transparent substrate having predefined active regions and non-active regions. Thereafter, the method includes spraying droplets of a lacquer on the predefined active regions to form corresponding lacquer layer regions, such that the non-active regions do not have presence of the lacquer. The lacquer layer regions are of a predefined thickness to enable their functional texturing. Texturing of lacquer layer enables light trapping or light extraction. Thereafter, one or more semiconductor layers are deposited o the lacquer layer regions and a cover substrate is provided. The cover substrate is joined to the transparent substrate at a portion of the non-active regions and encapsulates the lacquer layer regions and the one or more semiconductor layers between itself and the transparent substrate.