Invention Grant
US08426278B2 Semiconductor devices having stressor regions and related fabrication methods
有权
具有应力区域和相关制造方法的半导体器件
- Patent Title: Semiconductor devices having stressor regions and related fabrication methods
- Patent Title (中): 具有应力区域和相关制造方法的半导体器件
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Application No.: US12797420Application Date: 2010-06-09
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Publication No.: US08426278B2Publication Date: 2013-04-23
- Inventor: Akif Sultan , Indradeep Sen
- Applicant: Akif Sultan , Indradeep Sen
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES, Inc.
- Current Assignee: GLOBALFOUNDRIES, Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
Apparatus for semiconductor device structures and related fabrication methods are provided. A method for fabricating a semiconductor device structure on an isolated region of semiconductor material comprises forming a plurality of gate structures overlying the isolated region of semiconductor material and masking edge portions of the isolated region of semiconductor material. While the edge portions are masked, the fabrication method continues by forming recesses between gate structures of the plurality of gate structures and forming stressor regions in the recesses. The method continues by unmasking the edge portions and implanting ions of a conductivity-determining impurity type into the stressor regions and the edge portions.
Public/Granted literature
- US20110303980A1 SEMICONDUCTOR DEVICES HAVING STRESSOR REGIONS AND RELATED FABRICATION METHODS Public/Granted day:2011-12-15
Information query
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