Invention Grant
- Patent Title: Hardenable epoxy resin composition
- Patent Title (中): 可硬化环氧树脂组合物
-
Application No.: US11916105Application Date: 2006-05-17
-
Publication No.: US08426504B2Publication Date: 2013-04-23
- Inventor: Takahiro Mori , Setsuko Hirakawa , Yoshihiro Fukuda , Seiichi Saito , Yoshinori Takahata , Mitsunori Ide
- Applicant: Takahiro Mori , Setsuko Hirakawa , Yoshihiro Fukuda , Seiichi Saito , Yoshinori Takahata , Mitsunori Ide
- Applicant Address: JP Tokyo
- Assignee: Adeka Corporation
- Current Assignee: Adeka Corporation
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2005-158535 20050531; JP2006-071416 20060315
- International Application: PCT/JP2006/309793 WO 20060517
- International Announcement: WO2006/129480 WO 20061207
- Main IPC: C08K5/49
- IPC: C08K5/49
Abstract:
The epoxy resin composition of the present invention is characterized in that a polyamide compound having a moiety derived from a hydroxyl substituted aromatic amine having a phenolic hydroxyl group adjacent to an amino group is used as an epoxy resin hardener.
Public/Granted literature
- US20100190899A1 HARDENABLE EPOXY RESIN COMPOSITION Public/Granted day:2010-07-29
Information query
