Invention Grant
US08426548B2 Polyimide film and adhesive film and flexible metal-clad laminate both obtained with the same
有权
聚酰亚胺膜和粘合剂膜以及柔性金属覆层层压板均获得
- Patent Title: Polyimide film and adhesive film and flexible metal-clad laminate both obtained with the same
- Patent Title (中): 聚酰亚胺膜和粘合剂膜以及柔性金属覆层层压板均获得
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Application No.: US11663622Application Date: 2005-09-14
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Publication No.: US08426548B2Publication Date: 2013-04-23
- Inventor: Takashi Kikuchi , Hisayasu Kaneshiro
- Applicant: Takashi Kikuchi , Hisayasu Kaneshiro
- Applicant Address: JP Osaka
- Assignee: Kaneka Corporation
- Current Assignee: Kaneka Corporation
- Current Assignee Address: JP Osaka
- Agency: Kagan Binder, PLLC
- Priority: JP2004-277224 20040924; JP2004-333666 20041117
- International Application: PCT/JP2005/016889 WO 20050914
- International Announcement: WO2006/033267 WO 20060330
- Main IPC: C08G73/00
- IPC: C08G73/00 ; B32B7/12 ; B32B15/08
Abstract:
A polyimide film which, especially when superposed on a metal layer by the laminating method, has the function of diminishing the thermal distortion to be imposed on the material; an adhesive film and a flexible metal-clad laminate each comprising or obtained with the polyimide film. the polyimide film is obtained by reacting an aromatic diamine with an aromatic acid dianhydride and imidiating the polyamic acid obtained, and has a storage elastic modulus in a specific range.
Public/Granted literature
- US20090197110A1 Novel polyimide film and adhesive film and flexible metal-clad laminate both contained with the same Public/Granted day:2009-08-06
Information query
