Invention Grant
US08426550B2 Polyamic acid, polyimide, manufacturing method thereof, and polyimide film
有权
聚酰胺酸，聚酰亚胺，其制造方法和聚酰亚胺膜
- Patent Title: Polyamic acid, polyimide, manufacturing method thereof, and polyimide film
- Patent Title (中): 聚酰胺酸，聚酰亚胺，其制造方法和聚酰亚胺膜
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Application No.: US12831805Application Date: 2010-07-07
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Publication No.: US08426550B2Publication Date: 2013-04-23
- Inventor: Byung-Hee Sohn , Young-Suk Jung , Yoo-Seong Yang , Sang-Mo Kim , Eun-Seog Cho
- Applicant: Byung-Hee Sohn , Young-Suk Jung , Yoo-Seong Yang , Sang-Mo Kim , Eun-Seog Cho
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2009-0121467 20091208
- Main IPC: C07C219/32
- IPC: C07C219/32 ; C08G64/40
Abstract:
A polyamic acid that is a condensation reaction product of one or more acid anhydrides and one or more carbonate-based diamine compounds, along with a polyimide obtained by imidizing the polyamic acid, a method of manufacturing the same, and a polyimide film made therefrom.
Public/Granted literature
- US20110137009A1 POLYAMIC ACID, POLYIMIDE, MANUFACTURING METHOD THEREOF, AND POLYIMIDE FILM Public/Granted day:2011-06-09
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