Invention Grant
- Patent Title: Flexible PCB of spindle motor
- Patent Title (中): 主轴电机的柔性PCB
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Application No.: US12692422Application Date: 2010-01-22
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Publication No.: US08426738B2Publication Date: 2013-04-23
- Inventor: Jun Sup Shin , Bum Cho Kim
- Applicant: Jun Sup Shin , Bum Cho Kim
- Applicant Address: KR Suwon, Gyunggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-do
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Priority: KR10-2009-0116956 20091130
- Main IPC: H05K1/02
- IPC: H05K1/02

Abstract:
Disclosed herein is a flexible printed circuit board (PCB) of a spindle motor. The flexible PCB includes a solder part, an upper reinforcing plate, a lower reinforcing plate, and a soldering part. The solder part has a through hole so that a coil extending from a stator core passes through the solder part, and has a separation part which is open or closed only in one direction along with the through hole. The upper reinforcing plate supports the upper portion of the separation part. The lower reinforcing plate supports the lower portion of the solder part, and has an elliptical through hole which partially overlaps with the through hole so that the coil passes through the lower reinforcing plate. The soldering part is formed to enable the coil to be secured to the solder part.
Public/Granted literature
- US20110127071A1 FLEXIBLE PCB OF SPINDLE MOTOR Public/Granted day:2011-06-02
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