Invention Grant
- Patent Title: Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate
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Application No.: US13046544Application Date: 2011-03-11
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Publication No.: US08426741B2Publication Date: 2013-04-23
- Inventor: Hiroshi Yamazaki
- Applicant: Hiroshi Yamazaki
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JPP2008-214113 20080822
- Main IPC: H05K1/03
- IPC: H05K1/03
Abstract:
A photosensitive conductive film 10 according to the invention includes a support film 1, a conductive layer 2 containing conductive fiber formed on the support film 1, and a photosensitive resin layer 3 formed on the conductive layer 2.
Public/Granted literature
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