Invention Grant
- Patent Title: Lead pin for mounting semiconductor and printed wiring board
- Patent Title (中): 引脚用于安装半导体和印刷电路板
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Application No.: US12725546Application Date: 2010-03-17
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Publication No.: US08426748B2Publication Date: 2013-04-23
- Inventor: Masanori Kawade , Hiroyuki Tsuruga , Makoto Ebina
- Applicant: Masanori Kawade , Hiroyuki Tsuruga , Makoto Ebina
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-268521 20040915
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A lead pin comprising including a body having a shaft portion and a flange portion. The flange portion has at least one flat portion configured to face a connection pad and groove portions positioned to face toward the connection pad and extending from a peripheral portion toward a center portion of the flange portion, the flat portion includes extending portions extending from a center of the flange toward the peripheral portion of the flange and connected at the center of the flange, and the groove portions are tilted to become deeper toward the peripheral portion of the flange.
Public/Granted literature
- US20100187004A1 LEAD PIN FOR MOUNTING SEMICONDUCTOR AND PRINTED WIRING BOARD Public/Granted day:2010-07-29
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