A thermal imaging microelectronic device including: a support, a plurality of metal levels for interconnecting electronic components formed on the support, an array of thermal detectors formed on the support, each detector including a membrane with which radiant energy may be absorbed and one or more electric signals may be provided depending on the absorbed radiant energy, and a readout circuit that reads out the electric signals from the membrane, the readout circuit being integrated to the support, and at least several of the detectors having a readout circuit provided with an integrator including at least one integration capacitor disposed facing the membrane, the capacitor having at least one upper plate made in a given interconnection metal level of the plurality of interconnection metal levels.