Strained NMOS transistor featuring deep carbon doped regions and raised donor doped source and drain

Invention Grant

US08426858B2 Strained NMOS transistor featuring deep carbon doped regions and raised donor doped source and drain 有权

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Patent Title: Strained NMOS transistor featuring deep carbon doped regions and raised donor doped source and drain
Application No.: US12956020

Application Date: 2010-11-30
Publication No.: US08426858B2

Publication Date: 2013-04-23
Inventor: Michael L. Hattendorf , Jack Hwang , Anand Murthy , Andrew N. Westmeyer
Applicant: Michael L. Hattendorf , Jack Hwang , Anand Murthy , Andrew N. Westmeyer
Applicant Address: US CA Santa Clara
Assignee: Intel Corporation
Current Assignee: Intel Corporation
Current Assignee Address: US CA Santa Clara
Agent Kenneth A. Nelson
Main IPC: H01L29/04
IPC: H01L29/04 ; H01L31/036

Strained NMOS transistor featuring deep carbon doped regions and raised donor doped source and drain

Abstract:

Some embodiments of the present invention include providing carbon doped regions and raised source/drain regions to provide tensile stress in NMOS transistor channels.

Public/Granted literature

US20110068403A1 STRAINED NMOS TRANSISTOR FEATURING DEEP CARBON DOPED REGIONS AND RAISED DONOR DOPED SOURCE AND DRAIN Public/Granted day:2011-03-24

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L29/00	专门适用于整流、放大、振荡或切换，并具有至少一个电位跃变势垒或表面势垒的半导体器件；具有至少一个电位跃变势垒或表面势垒，例如PN结耗尽层或载流子集结层的电容器或电阻器；半导体本体或其电极的零部件（H01L31/00至H01L47/00，H01L51/05优先；除半导体或其电极之外的零部件入H01L23/00；由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00）
H01L29/02	.按其半导体本体的特征区分的
H01L29/04	..按其晶体结构区分的，例如多晶的、立方体的或晶面特殊取向的（以其物理缺陷为特征的入H01L 29/30）