The present invention discloses an LED package structure which has a housing, an LED chip and a transparent encapsulant. The housing has a recess and a plurality of protrusions. The LED chip is mounted in the recess of the housing, and covered in the recess by the transparent encapsulant. The protrusions are formed in the recess or on the edge of the housing. The protrusions of the present invention can form the uneven shape of the surface of the transparent encapsulant, so as to increase the diffusion angle of the light and enhance the light extraction efficiency.